In short, instead of having separate QSFP/QSFP-DD modules on the front panel, the optical I/O is built into the package. As Intel explains, placing the optics “near the switch within the same package” drastically reduces the electrical path and saves power. From Jensen Huang showcasing CPO switches at GTC 2025 to a wide range of vendors demonstrating optical engines integrated inside ASIC packages at OFC 2025, CPOs are everywhere. However, it's worth noting that Andy Bechtolsheim, co-founder of Arista and a long-standing visionary in data centre. Co-packaged optics (CPO) is quickly becoming a foundational technology for next-generation AI data centers. Hyperscale data centers are confronting a performance wall, where the traditional chip-to-port connection imposes structural limits on throughput and. Co-packaged optics (CPO) represents a transformative approach in optical networking, where optical and electronic components are tightly integrated into a single package, typically on the same substrate as the chip. ) that slot into cages on the switch faceplate.