The COB process refers to a technology that directly mounts bare chips onto a printed circuit board (PCB), connects them via gold wire bonding, and then encapsulates and protects the chips and wires using organic adhesive. Compared with conventional processes, the COB process offers high packaging. BOX packaging seals optical chips in a metal enclosure with inert gas, ensuring long-term stability for high-performance transceivers. TO-CAN packaging, originating from the semiconductor industry, provides a compact and cost-effective solution, ideal for small optical modules. Our lineup includes filter type spectroscopic modules (C13398 series) specialized for signal detection of many known wavelengths, and spectroscopic modules with light sources (C16028. Common optical device packaging methods include COB (chip-on-board packaging), BOX and coaxial packaging. It has many advantages when compared to the hermetically sealed co-axial TO can packaging of Free Space Optics (FSO). Optical module (Figure 1) is an important component in the optical communication system, the main function is to realize the photovoltaic conversion and the monitoring and management of communication signals and other functions.
