As pluggable modules scale to 400G and beyond, thermal management becomes a primary reliability constraint. This article explains contemporary thermal strategies for OSFP modules — from fin geometry tuning to detachable heatsink covers — and maps measured performance to practical. OSFP (Octal Small Form-factor Pluggable), as a mainstream high-speed packaging format, offers two main thermal solutions: OSFP IHS (Integrated Heat Sink) and OSFP RHS (Riding Heat Sink). This article will explain the differences between the two designs to help users choose the appropriate product. Explore the latest strategies in air and liquid cooling, and discover the future of optical module cooling. In the fast-evolving world of high-speed data transmission, OSFP (Octal Small Form-factor Pluggable) optical modules stand out as a cornerstone for next-generation networking. These modules are engineered to handle massive data rates, from 400G to 800G and beyond, making them essential for data. An efective heat dissipation of uncooled 400-Gbps (16×25-Gbps) form-factor pluggable (CDFP) optical transceiver module employing chip-on-board multimode 25-Gbps vertical-surface-emitting-laser (VCSEL) and 25-Gbps photodiode (PD) arrays mounted on a brass metal core embedded within a printed circuit. FIG7is an exploded schematic diagram of a heat sink device according to an embodiment of the present disclosure. 9is a schematic diagram of assembling a heat sink device and an.